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This Concept Map, created with IHMC CmapTools, has information related to: Qing_thesis_map, polyimide Project 1 cMUT, Key properties 1. sputtered amorphous SiC has close to zero stress 2. sputtering process has low temperature C 3. the process pressure during sputtering process is very low 6.5 mTorr 4. high elastic modulus 223 GPa??? enable low temperature processing, surface micromachining techniques needs Sacrifiical material, SiC as membrane material Project 3 Pressure sensor, monolithic-integrated MEMS needs almost-vacuum sealing, dry-release material can be polyimide, monolithic-integrated MEMS is built by surface micromachining techniques, SiC as membrane material and sealing layer Project 1 cMUT, dry-release material can be PPC, PPC Project 2 thin-film wafer-level packaging, Key properties 1. sputtered amorphous SiC has close to zero stress 2. sputtering process has low temperature C 3. the process pressure during sputtering process is very low 6.5 mTorr 4. high elastic modulus 223 GPa??? enable almost-vacuum sealing, Sacrifiical material can be categorized into dry-release material, PPC Project 3 Pressure sensor, monolithic-integrated MEMS needs good mechanical structural material and no creep, monolithic-integrated MEMS can be categorized into MEMS built before IC, monolithic-integrated MEMS can be categorized into MEMS built after IC, SiC as cap and sealing layer Project 2 thin-film wafer-level packaging, MEMS built after IC needs low temperature processing, SiC has Key properties 1. sputtered amorphous SiC has close to zero stress 2. sputtering process has low temperature C 3. the process pressure during sputtering process is very low 6.5 mTorr 4. high elastic modulus 223 GPa???, Sacrifiical material can be categorized into wet-release meaterial